☰

Engineering & Transportation

Electrical & Electronics

Microelectronics

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Sold Out / Out of Stock

Condition: USED (All books are in used condition)

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ItemPartNumber 23129494
UnitCount 1
EANs 9780387765327
ReleaseDate 0000-00-00

You might also like...

Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Handbook of 3D Integration, Volume 3: 3D Process Technology

Handbook of 3D Integration, Volume 3: 3D Process Technology

Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits

Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits

3D IC Stacking Technology

3D IC Stacking Technology