Handbook of 3D Integration, Volumes 1 and 2: Technology and

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Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits

The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration.

The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
Country USA
Brand Wiley
Manufacturer Wiley-VCH
Binding Paperback
ItemPartNumber Illustrations (some col.)
UnitCount 1
EANs 9783527332656
ReleaseDate 0000-00-00

Country	USA
Brand	Wiley
Manufacturer	Wiley-VCH
Binding	Paperback
ItemPartNumber	Illustrations (some col.)
UnitCount	1
EANs	9783527332656
ReleaseDate	0000-00-00

Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits

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