DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2)
Country USA
Brand World Scientific Publishing Company
Manufacturer World Scientific Pub Co Inc
Binding Hardcover
UnitCount 1
EANs 9789814508599
ReleaseDate 0000-00-00

Country	USA
Brand	World Scientific Publishing Company
Manufacturer	World Scientific Pub Co Inc
Binding	Hardcover
UnitCount	1
EANs	9789814508599
ReleaseDate	0000-00-00

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2)