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Engineering & Transportation

Electrical & Electronics

Advanced Flip Chip Packaging

$ 1,104

Availability: Currently in Stock

Delivery: 10-20 working days

Condition: USED (All books are in used condition)

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ItemPartNumber 9469625
UnitCount 1
EANs 9781441957672
ReleaseDate 0000-00-00