3D Microelectronic Packaging: From Fundamentals to

Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ItemPartNumber 45539203
EANs 9783319445847
ReleaseDate 0000-00-00

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)